One large heat sink for ARM processor, two small heatsinks one for LAN controller and the other for 3.3V regulator 3M adhesive thermal tape for efficient thermal transfer to the heat sink, providing additional cooling to the IC Can be used with other devices such as the Beaglebone to cool the processor, regulators, etc. Also works on the SMCI USB/NIC controller chip, although it is somewhat larger than the chip itself
0.005
Package weight: 0.027 kg Product Size(L x W x H): 1.40 x 1.40 x 0.60 cm / 0.55 x 0.55 x 0.24 inches Package Size(L x W x H): 5.00 x 3.00 x 1.00 cm / 1.97 x 1.18 x 0.39 inches
Package Contents: 1 x Chip Heat Dissipation Panel ( 14 x 14 x 6 mm ), 2 x Chip Heat Dissipation Panel ( 8 x 8 x 5 mm )
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